Press Kit: Intel at Auto Shanghai 2025

At Intel Automotive's debut at Auto Shanghai, the company unveiled an industry-first chiplet system-on-chip and new customer collaborations. During the event on April 23-24, 2025, the company also demonstrated cutting-edge in-cabin experiences – including AAA gaming, a 3D human-machine interface, local in-vehicle large language models and efficient energy management. 

News

• Intel Accelerates Software-Defined Vehicles with Next-Gen SoC and Partners
• Postcard from Auto Shanghai: Let Your Passengers Game While You Drive
• Postcard from Auto Shanghai: Intel, ModelBest Deliver a Personalized LLM

Images

Jack Weast, Intel Fellow, vice president and general manager of Intel Automotive, announces a new strategic collaboration with ModelBest at the Auto Shanghai event on Wednesday, April 23, 2025. The agreement leverages ModelBest's success with Intel's AI PC acceleration program, optimizing AI for a seamless out-of-the-box experience on Intel's automotive platform. (Credit: Intel Corporation)

Jack Weast, Intel Fellow, vice president and general manager of Intel Automotive (right), and Li Dahai, CEO of ModelBest, announce a new strategic collaboration at the Auto Shanghai event on Wednesday, April 23, 2025. The agreement leverages ModelBest's success with Intel's AI PC acceleration program, optimizing AI for a seamless out-of-the-box experience on Intel's automotive platform. (Credit: Intel Corporation)

Yu Peng, head of technology at XPeng – a leading AI-driven mobility company headquartered in Guangzhou, China – test drives Forza Horizon 5, a popular racing game at Intel’s Auto Shanghai event booth on Wednesday, April 23, 2025. (Credit: Intel Corporation)

Yu Peng, head of technology at XPeng – a leading AI-driven mobility company headquartered in Guangzhou, China – test drives Forza Horizon 5, a popular racing game at Intel’s Auto Shanghai event booth on Wednesday, April 23, 2025. (Credit: Intel Corporation)

Visitors and Intel demo experts tour the Intel booth at the Auto Shanghai event on Wednesday, April 23, 2025. At the event, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC). The SoC features the automotive industry’s first chiplet architecture. Intel also announced new strategic collaborations with leading automotive innovators ModelBest and Black Sesame Technologies. (Credit: Intel Corporation)

Intel’s booth at the Auto Shanghai event greeted visitors to a collection of demos and announcements on Wednesday, April 23, 2025. At the event, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC). The SoC features the automotive industry’s first chiplet architecture. Intel also announced new strategic collaborations with leading automotive innovators ModelBest and Black Sesame Technologies. (Credit: Intel Corporation)

Visitors and Intel demo experts tour the Intel booth at the Auto Shanghai event on Wednesday, April 23, 2025. At the event, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC). The SoC features the automotive industry’s first chiplet architecture. Intel also announced new strategic collaborations with leading automotive innovators ModelBest and Black Sesame Technologies. (Credit: Intel Corporation)

Visitors and Intel demo experts tour the Intel booth at the Auto Shanghai event on Wednesday, April 23, 2025. At the event, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC). The SoC features the automotive industry’s first chiplet architecture. Intel also announced new strategic collaborations with leading automotive innovators, ModelBest and Black Sesame Technologies. (Credit: Intel Corporation)

Jack Weast, Intel Fellow, vice president and general manager of Intel Automotive, unveils the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC) at the Auto Shanghai event on Wednesday, April 23, 2025. The SDV SoC includes the automotive industry’s first chiplet architecture. (Credit: Intel Corporation)

Jack Weast, Intel Fellow, vice president and general manager of Intel Automotive (right), joins Huang Li, senior vice president of Desay SV at the Auto Shanghai event on Wednesday, April 23, 2025. At the event, Intel showed how it collaborates with the ecosystem to accelerate innovation in AI-powered cockpits, integrated advanced driver-assistance systems (ADAS) solutions and energy-efficient vehicle compute platforms. (Credit: Intel Corporation)